Semiconductor
From nanotube manufacture and zero-width glass separation to precision cutting, scribing and dicing wafers.
Pulsed Nd:YAG lasers produce the necessary pulse energy and peak power for the manufacture of these small, versatile cylinders.
With accelerated production times and smaller kerf widths, lasers are an effective method of processing wafer materials at various thicknesses.
Lasers are used to separate glass in the manufacture of flat panel displays. This special technique uses lasers to build up stresses in the glass that result in a clean break.
